Genetic Diversity and Population Structure Analyses of Wild Relatives and Cultivated Cowpea (Vigna unguiculata(L.) Walp.) from Senegal Using Simple Sequence Repeat Markers
PLANT MOLECULAR BIOLOGY REPORTER
Authors: Sarr, Awa; Bodian, Amy; Gbedevi, Kodjo Mawuena; Ndir, Khadidiatou Ndoye; Ajewole, Oyatomi Olaniyi; Gueye, Badara; Fonceka, Daniel; Diop, Elisabeth A. M. C.; Diop, Baye Magatte; Cisse, Ndiaga; Diouf, Diaga
Abstract
Cowpea (Vigna unguiculata(L.)) is an important crop for food security in Senegal; therefore, understanding the genetic diversity of local germplasm is relevant for crop improvement and genetic maintenance in the era of climate change. For this purpose, 15 microsatellite markers were used to estimate the genetic diversity of Senegalese cowpea germplasm, including 671 accessions grown in eight regions and 66 wild relatives and intermediate forms (weedy). For the cultivated, the main expected heterozygosity (mHe) ranged between 0.317 (Fatick) and 0.439 (South). A narrow genetic variation between accessions from the different regions was observed with genetic similarity ranging from 0.861 to 0.965 and genetic differentiation indices (Fst) between 0.018 and 0.100. The accessions from southern Senegal (Kedougou, Sedhiou, and Kolda regions) are more diverse than the others. However, the accessions from the North (Saint-Louis) are genetically different from other regions. The diversity analysis in wild relatives from Senegal, which had never been performed before, revealed that the wild/weedy forms remain more diverse than the cultivated with genetic diversity values (He) of 0.389 and 0.480, respectively. STRUCTURE software divided the Senegalese germplasm into five subpopulations. Three of them (i, ii, and iii) included only cultivated accessions from several regions, one (v) mainly from Saint-Louis, and one (iv) the wild/weedy with some cultivated accessions. Our results support the hypothesis thatVigna unguiculatavar.spontaneais the wild progenitor of cowpea. The accessions from the South, the northern recession accessions, and the wild/weedy could serve as sources of new genes for the genetic improvement of cowpea in Senegal.
Fracture characterization of overmold composite adhesion
JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS
Authors: Hartley, W. Douglas; McCann, John; Davis, Scott; Hocker, Tom; Bobba, Somasekhar; Verghese, Nikhil; Bajaj, Devendra; Yu, Hang Z.; Dillard, David A.
Abstract
A general testing approach is presented via a fracture mechanics study on the interfacial delamination behavior in overmolded composite materials using a variant of the double cantilever beam (DCB) geometry. Overmolding, a common injection molding process, is used to fabricate asymmetric DCB test specimens with Lexan (TM) 3414 resin overmolded onto commercially available TenCate Cetex (R) FST woven glass fiber/polycarbonate laminates. An analytical beam theory model is employed to partition the planar fracture modes at the overmold interface into mode I and mode II components, which are functions of material properties and relative beam thicknesses. Specimen curvature measurements are integrated into the beam theory model to estimate the residual stress effects on fracture mode mixity. We use the overmold thickness as a tunable variable to control fracture mode mixity, and target near mode I fracture conditions, where we find mode I fracture energy (G (Ic)) values of approximately 1 kJ/m(2). Fiber bridging across the failure interface is observed, which is not expected at the nominal polymer/polymer overmold interface. Complementary scanning electron microscopy images of the failure surfaces indicate crack initiation at the overmold interface, followed by a change in locus of failure to the nearby polymer/glass fiber interface in the top layer of the composite laminate. Fiber bridging is observed in all specimens tested over a modest range of mode mixity, including specimens modified to the single leg bending geometry, suggesting that the polymer/glass interface is more susceptible to crack propagation than the desired overmold interface, which likely derives its strength from molecular interdiffusion during the overmolding process.